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Online EL defect detector
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Equipment functions
Suitable for the detection of obvious/hidden crack, fragment, black chip, broken grid, sintered mesh, contamination and other defects of crystal silicon cell.
Equipment characteristics
■Infrared imaging camera, direct shooting
■Are suitable for multi-specification components
■The fault is automatically powered on
■Water signal docking
■Are connected to the MES system
Equipment technical parameters
Model
ST-EL10
Component size
1600*1000mm to 2600*1600mm
Scanning method
Direct scanning
Position
Before Lamination / After Lamination
Component in and out method
The form of incoming and outgoing materials can be changed according to demand
Transfer table height
950±30mm
Speed
24s/pcs (Testing and judgement)
Camera type
Dedicated HD Industrial Camera
Effective test area
2500×1400 mm
Resolution
2560×1440
Accuracy
0.57mm/pixel
monitor
4K 50InchUltra clear display
Constant current power supply
Programmable Power
Current range
0~13.4A, Adjustable
Voltage range
0~60V, Adjustable
Dimensions
2920×2600×1250 mm
weight
0.8T
